Innovate  
 
Cooling of Circuit Board

An electronic circuit board gets heated due to presence of resistive elements. The temperature profile generated across the board could be imulated as shown in the adjacent figure using heat transfer module in COMSOL. Such a simulation would help in locating the hot spots and providing air drafts or heat sinks to eliminate thermal failure.

 

Based on the reference model we can change the parameters & scale or reduce it according to your requirement, to get quick results.
 
Design and Services
 
Extruder Die Characteristics
Residence Time Distribution
Electrokinetic Flow around a corner

To know more
Call : 080 – 41105384/                   41109162

email :